Used ESEC 2008 HS3 Plus #9147297 for sale

ESEC 2008 HS3 Plus is a die-attaching machine designed for high volume production of microelectronic components in the form of wafer chips or die packages. It is capable of handling different substrates including: ceramic, metal-clad ceramic, silicon, and polyimide foam. The HS3 Plus offers an automated device-prebonding stage which ensures that all die are securely and accurately placed on the substrate prior to the die-attaching process. The machine is composed of a main frame, work stages, die loading and unloading stations,pre-bonding station, and the optoelectronic system. It is designed to be capable of running different processes such as flip chip, wire bonding, die attach, sealant dispensing, etc. The work stages move the die accurately into position and its peristaltic pumps and heaters provide high precision temperature profile control. The embedded optoelectronic system of the HS3 Plus includes a high resolution CCD camera and an image recognition system that Check die before pre-bonding, thus assuring accurate positioning of the device. This ensures consistent and reliable performance of the machine. In addition, laser markers can be used for permanent marking on the wafers. The HS3 Plus is equipped with two independent die loading stations, capable of handling different dies or sizes simultaneously, thus speeding up the die-mounting process. The HS3 Plus is preferably used in advanced IC packaging and the production of high frequency and micro-electronic components requiring sophisticated level of accuracy and repeatability. It is designed to provide high-precision, stable, and reliable production lines with a long service life. Moreover, it provides ease of maintenance and operation with a real-time monitoring interface, programmable settings for pre-bonding steps, remote-control capability, intuitive operation interfaces, and error display capability.