Used ESEC 2008 HS3 Plus #9223598 for sale

ESEC 2008 HS3 Plus is an automated die attacher used to mount dies to printed circuit boards (PCBs) quickly and reliably. It is a fully automated equipment capable of handling high volumes of components with speeds up to eight times faster than manual mounting. The system features an advanced vision unit to accurately align and attach dies to their destination. ESEC 2008HS3PLUS uses a motorized die pick-up unit to pick up the dies from the tray, feed them into the board, and place them in their designated locations. The unit features a suction head that can be adjusted to accommodate a variety of die sizes and types. The machine can also be operated in a 2-sided mode that allows dies to be placed in multiple locations on the PCB. 2008 HS 3 PLUS also features a vision tool that ensures the accuracy of die mounting and alignment. An advanced image-processing algorithm automatically locates and adjusts the die placement and orientation. The asset relies on multi-directional illumination combined with real-time contrast adjusting to ensure accurate and reliable die placement. ESEC 2008 HS 3 PLUS can be integrated with other devices and platforms. It is compatible with most SMT printers, assemblers, chip shooters, and dispensers, allowing production lines to be streamlined. Furthermore, the model is easy to use with a user-friendly software interface. Overall, 2008 HS3 Plus is an automated die attacher with a high level of accuracy and speed. It is ideal for high-volume production lines, featuring an advanced vision equipment, adjustable suction head, and compatibility with other production devices and platforms. Its user-friendly software provides a clear and intuitive way to operate the machine and ensure consistent results.