Used ESEC 2008 HS3 Plus #9229470 for sale

ESEC 2008 HS3 Plus is a high-speed die ataching machine designed for the efficient die bonding of semiconductor packages and other electrical devices. It offers high levels of precision and accuracy for die handling and attachment. The machine consists of several components, including a projection microscope and die picker head, die sorting and inspection station, and a die cutting and sorting module. The projection microscope allows for accurate die placement and alignment while the die picker head enables a precise and consistent die placement accuracy. The die sorting and inspection station provides instant sorting and removal of defective die and allows for sorting of die size, pattern geometry, and pitch. The die cutting and sorting module consists of a multi-axis conveyer and a die picker system. This module allows for accurate and consistent die cutting and sorting of die of different sizes, pitch, and geometry. The HS3 Plus also offers a hot die bonder module, comprising of an optically controlled spindle and heater head, which allows for accurate and precise bonding and thermal coupling of the die. The hot die bonder is capable of dispensing micro-droplets of a special die bond adhesive. The machine also features an electrical tester and sensor module, which allows for automated testing and sorting of die based on their voltage ratings. Additional features of the machine include an optional dispenser and electrical bonding module that allow for increased speed and accuracy when bonding thin films. ESEC 2008HS3PLUS is a powerful and reliable die attachment machine designed for a variety of industries that require precise, automated, and efficient die attachment. The machine's innovative design, high degree of accuracy, and reliable operation make it a great choice for die bonding and attachment needs.