Used ESEC 2008 HS3 Plus #9235845 for sale

ESEC 2008 HS3 Plus is a fully automated die attacher designed to increase the efficiency and accuracy of applying die bonds to PCBs. The equipment offers a comprehensive range of features including a programmable four-head applicator head which can pick and place a variety of die sizes, an advanced monitoring system which offers real-time process feedback, and a die pick-and-place unit with vacuum force to ensure secure placement. The HS3 Plus has a hardworking motor drive and an advanced four-head applicator head machine with manual die loading. The head tool has built-in intelligence for setting the die pitch and alignment adjustments, enabling accurate pick-and-places, even with components of different sizes and thickness. An advanced monitoring asset allows for real-time process feedback providing operational performance data, allowing the user to identify and resolve problems immediately. The HS3 Plus die placement model is designed to allow for a wide range of placement angles, and it offers two high-precision X-Y movement stages and a rigid Z-axis stage for accurate die trapping. The die attachment equipment also includes a vacuum force adjustment feature to ensure secure die placement. In addition, the system has built-in safety fail-safes, adjustable speed control, and an ergonomic design to make operation easier and more comfortable. With highly advanced die pick and place technology, programmable four-head unit with manual die loading, and real-time process feedback, ESEC 2008HS3PLUS die attacher is an ideal solution for increased production throughput and improved operational accuracy. This makes it a great choice for industries where the accuracy and efficiency of die bond placement is critical.