Used ESEC 2008 HS3 Plus #9235846 for sale

ESEC 2008 HS3 Plus Die Attacher is a precision tool that is used for attaching dies to printed circuit boards. It can be used on a wide variety of PCBs, including BGA, CSP, and Flip-Chip modules. The HS3 Plus is precise and easy to use, allowing it to increase accuracy and efficiency in die-attach processes. The HS3 Plus Die Attacher features an adjustable PFO-1800 force-measuring equipment that provides accurate pressure readings. The force measure ensures optimal head engagement with the die, providing consistent results each time. In addition, the HS3 Plus can be programmed to make necessary adjustments such as speed, pressure, and position for any given job. This eliminates the need for manual adjustment each time a new job is performed. The HS3 Plus is equipped with a Finger Feeding System (FFS) that provides precise adhesive dispensing. The FFS is able to dispense any type of adhesive, including solvent, UV and thermally-curable adhesives. This makes the HS3 Plus suitable for a variety of die-attach applications, such as attaching lidless discs, converting SOJ packages into 0.5mm-pitch packages, and attaching soft resins or flip-chip dies. The HS3 Plus also has a unique Modular Head Assembly unit that allows users to quickly and easily switch between different heads. This makes it easy to switch between different applications, such as surface solder bump and lead frame attach. The HS3 Plus Die Attacher is designed for maximum productivity and accuracy. It has a vision machine that enables the automatic alignment of tooling to the die. This eliminates the need for manual alignment, saving time and ensuring accurate results. The HS3 Plus also has adjustable heads and a secondary head that can be used to make corrections. The HS3 Plus is an advanced piece of equipment that helps improve the productivity and accuracy of die-attach processes. Its reliable performance and easy-to-use features make it an ideal choice for any die-attach task.