Used ESEC 2008 HS3 Plus #9258200 for sale

ESEC 2008 HS3 Plus die attacher is an innovative engineering tool designed to meet the needs of the modern production line. This board-level device combines die attach and wire bonding technology into a single, high-precision system. By combining two essential technologies, this device streamlines the process of creating electronics and reduces overall time-to-market. In terms of features, ESEC 2008HS3PLUS die attacher has a die bond head capable of precise movements as well as a motorized die-attaching prober. Additionally, it is equipped with a high-speed race track actuator which makes its movements fast and accurate. Furthermore, the machine offers an auto-switching capability that enables it to switch from bonding to attaching without the need to adjust settings. When it comes to die attach technology, 2008 HS 3 PLUS die attacher is capable of handling a wide range of strip sizes, ranging from 0.4mm to 1.2mm. It also allows the user to adjust the vacuum pressure for optimum adhesion. Other features include a hot-bar soldering station for high-speed and low-temperature soldering, an adjustable heater with a maximum temperature of 480°C, and an operator-friendly LED display. The wire bonding portion of 2008HS3PLUS die attacher is also highly capable. It is equipped with a full-range bonding head that is designed for both flat wire and ribbon bonding. Additionally, it features an adjustable bonding speed of up to 2500 revolutions per minute and can handle both aluminum and copper wire sizes. Overall, 2008 HS3 Plus die attacher is designed with industry-leading technology and is able to take full advantage of the latest developments in production processes. Its ease of use and high degree of automation make it an ideal solution for any production line looking to minimize time-to-market and increase accuracy. ESEC 2008 HS 3 PLUS die attacher is the perfect tool for any engineer looking to reduce engineering time and maximize production capabilities.