Used ESEC 2008 HS3 Plus #9260894 for sale

ESEC 2008 HS3 Plus die attacher is a fully automated die attach equipment designed for the precision placement and bonding of a variety of components on both rigid and flexible substrates. ESEC 2008HS3PLUS offers high accuracy and repeatability, thanks to its closed-loop vision system. The unit utilizes a FlashVision™ digital camera with spot-lighting technology for precision die locating, and a high-resolution electromechanical Z-axis motion control machine to ensure precise placement and bonding of components. 2008 HS 3 PLUS is designed with a number of intuitive user-friendly operator controls, making for efficient, safe and accurate operation. The intuitive point-and-click panel consists of a movable touch screen, allowing the user to visually guide movement operations for the tool, as well as providing access to the advanced asset set-up functions. Other user interface controls include color-coded buttons that enable easy selection of designed movement programs and die attach locations. ESEC 2008 HS 3 PLUS is designed with high-speed capability, allowing for increased throughput on the production line. The model is also extremely flexible, allowing for quick changes of components, as well as different substrate types and sizes. The equipment's two integrated heated die bonders allow for the faster bonding of thermally sensitive components. For enhanced reliability and accuracy, 2008HS3PLUS is equipped with a fully enclosed environmental chamber, offering excellent protection against contamination or impacts to the surface of components. The enclosed chamber also ensures superior thermal stability and repeatability of die attach operations, eliminating the need for regular calibration. Furthermore, this system offers an integrated vision alignment operation, ensuring repeatable accuracy from setup to setup. 2008 HS3 Plus is designed for superior quality assurance, offering several features such as in-line die attach verification and micro-separation control systems. Additionally, for maximum process control, the unit can be interfaced with a third-party Factory Information Machine (FIS). In conclusion, ESEC 2008 HS3 Plus die attacher is an ideal solution for the precision placement and bonding of a variety of components on both rigid and flexible substrates. Offering superior flexibility, accuracy and reliability, the tool is ideal for production lines that require fast throughput with quality assurance.