Used ESEC 2008 HS3 Plus #9265577 for sale

ESEC 2008 HS3 Plus is an advanced, high-speed die attacher developed by ESEC Automation. The die attacher is designed to optimize die mounting times and is ideal for high-end applications. The HS3 Plus is a multi-station machine that accommodates up to 4 die-to-die and die-to-ejector pins. It features a C-frame construction for easy loading and unloading, and provides two tooling options for die handling. One option is an X-Y grid array, which provides a ±5mm range of motion for each die during bonding. This allows for placement of contact pads, and ensures that any peripheral connections are properly connected. The second tooling option is a dual-shank equipment, which provides a ±3mm range of motion for the die placement process. It also allows for custom die configurations and can be used for both standard and complex die packages. The HS3 Plus features a high-speed servo-motor with an integrated punch press. This allows for quick die attachment times and makes it suitable for high-volume assembly lines. Additionally, the HS3 Plus is equipped with a camera-based inspection system to ensure quality control. This unit inspects each die to ensure the correct alignment and bonding before and after the die placement process. The HS3 Plus provides a high-performance automatic die pick-and-place machine to further enhance the die attachment process. This tool can handle a wide variety of dies and die spacing requirements. In addition, the HS3 Plus is also compatible with many types of jigs, fixtures, and automation systems. The HS3 Plus is designed to be extremely reliable and is capable of handling more than 10,000 die attach cycles with low cycle times. It is compatible with most standard and custom die sizes and is capable of achieving a faster bonding process than other types of die attach technologies. Overall, ESEC 2008HS3PLUS die attacher is designed to offer an efficient and reliable solution for die attachment. It is highly versatile and suitable for many different types of die attach processes.