Used ESEC 2008 HS3 Plus #9266268 for sale

ESEC 2008 HS3 Plus is a die attacher for the semiconductor industry. It is developed by ESEC, a company specialized in HVAC (Heat, Ventilation and Air Conditioning) and die attach solutions. The HS3 Plus is a die attacher designed to meet the needs of high-volume pick-and-place operations that require precision accuracy and fast cycle times. This machine features an automated and highly efficient vision system which enables accurate die placement and reduces the likelihood of misalignments due to visual errors. The HS3 Plus is a multi-purpose kit, allowing for a wide range of attachment protocols such as sub-mount, standoff, wire bonding, and eutectic bonding. It also supports multi-die applications, with multiple dies enabled per cassette. The HS3 Plus has a quick changeover capability for increase versatility and changing between jobs is simple and quick. The intuitive touchscreen interface makes the setup and position adjustment of the device very user-friendly. The HS3 Plus, is ideal for semiconductor packaging applications due to its accuracy, speed, and versatility. The HS3 Plus is capable of cycle times of less than 1 second per die attach which makes it a perfect choice for large-scale production projects. It allows for high volumes of die attach operations with very precise placement results. Die sizes range from 01005 to 12mm with up to 48mm pitch capability for larger dies. The HS3 Plus utilizes advanced vision algorithms to achieve high accuracy accuracy and can be configured to handle challenging geometries. The HS3 Plus is an excellent die attacher for high volume production needs. It offers an efficient and accurate solution for attaching dies and can meet the stringent specifications of the semiconductor packaging industry. The HS3 Plus is supported by advanced vision algorithms and intuitive touchscreen interface, allowing for a fast and efficient setup and operation. It is an ideal choice for larger-scale projects due to its speed, accuracy, and wide range of attachment capabilities.