Used ESEC 2008 HS3 Plus #9278330 for sale

ESEC 2008 HS3 Plus is a semiconductor die attacher designed for reliable die-to-substrate attachment and to ensure an electrical interconnection between the semiconductor die and the substrate. ESEC 2008HS3PLUS features an easy-to-use automatic stepping mechanism with metered force control to accurately adjust the force required on the die-to-substrate interface. The gripper head can precisely adjust to different orientation of the die and substrate, making the equipment suitable for horizontal and vertical die-to-substrate applications. The HS3 Plus is equipped with an advanced laser displacement detector to accurately measure gap on the die-to-substrate interface. The integrated vision camera on the system can be used to measure the relative position of the die and substrate, avoiding misalignments during die-to-substrate attachment. In addition, the unit offers a consistent contact pressure along the duration of attachment by its force control machine. The integrated 6-axis active compliance coupled with the force control provides a secure attachment for fragile semiconductor die. In addition to the automated die-to-substrate attachment process, 2008 HS 3 PLUS has a number of smart features designed to reduce process time and increase throughput. The built-in thermal actuator ensures a uniform melt of the adhesive without any shear force applied to the die. The software supports user-defined process profiles to increase repeatability of the process and reduce misalignment while attaching the die. The tool also includes a dual side die detection sensor to accurately detect and measure the presence of die along the full depth of the process. Finally, the asset is equipped with a central electronic control unit and easy-to-use Graphical User Interface (GUI) which enables easy setup and operations of the die-to-substrate attachment process. The HS3 Plus is compatible with most standard microelectronic industry materials and is ideal for applications requiring 300um - 150um die-to-substrate attachments.