Used ESEC 2008 HS3 Plus #9289392 for sale

ESEC 2008 HS3 Plus is a state-of-the-art die attacher for use in the semiconductor industry. It is a versatile high speed head mounted die attacher for bonding multiple die on wafer and flip chip to form a circuit. ESEC 2008HS3PLUS has a specialized Interchangeable Energy Tank (IET) that enables the user to attach die through the use of ultrasound or pressure. This helps the user to choose the most suitable method based on their application. 2008 HS 3 PLUS is a digital die attacher designed with the latest technology to ensure its accuracy and reliability. This model has adjustable pressure and temperature settings with temperature compensation mechanism to guarantee reliable and environmentally friendly operation. It also allows the user to switch between different modes such as sonication or manual with high precision. 2008HS3PLUS is capable of handling a wide variety of die sizes and die types. It is equipped with double clamping dovetail for reliable die attachment and secure alignment. It has adjustable output power settings and input power monitoring for advanced process control. It uses a special vibration absorber for uniform and reliable pressure delivery. The machine is also provided with a vision system to ensure accurate die placement and alignment on the surface of the wafer. 2008 HS3 Plus features an optional automated die pick up system for loading and ejection of die. It is also equipped with various safety control features to reduce the risk of accidental microscopic damage to the wafer. The machine also has a built in monitoring system for checking the quality of every attached die. ESEC 2008 HS 3 PLUS has automated load and unloading functions that are designed to minimize manual intervention. The user can also program the machine to automatically close die attach damage after a few attachment cycles. This helps to prevent bad connections which can potentially lead to future problems associated with the die's reliability. ESEC 2008 HS3 Plus is an ultra-modern die attacher that offers superior quality and performance to its users. It is a reliable and dependable die attacher for applications in the semiconductor industry and other related fields.