Used ESEC 2008 HS3 Plus #9312223 for sale

ESEC 2008 HS3 Plus is a die attachment equipment manufactured by ESEC that is designed for high speed and precision die attach operations. It is a fully automated system that is able to handle a wide range of products, all sizes, types and shapes of die, die sets, and substrate materials.. The HS3 Plus features a high speed servo motor which is capable of up to 6,000 die placements per hour, while remaining highly accurate and precise. Additionally, the unit is equipped with a vision machine that allows it to rapidly orient and inspect the components before attaching them. This ensures that each component is correctly placed and that it meets the necessary specifications. The HS3 Plus also features an integrated jetting tool which is capable of up to 60 component placements per minute. Additionally, it is also equipped with a clocked die locations asset for use with product circuits. The model is also compatible with a number of different feeder types, allowing for an almost limitless range of components to be placed. The equipment features real time monitoring for temperature control throughout the process. In addition to its impressive speed and accuracy, the HS3 Plus also includes an onboard data management system which allows it to keep track of each component placed, including barcode acquisition, product rejection reports, and a statistical process control (SPC). This unit also allows different parameters to be tracked and monitored, such as deposition speed, pressure, temperature, and flux dispense volumes. The HS3 Plus is also designed for easy and quick maintenance, featuring a die exchange mechanism which makes it easier for maintenance personnel to exchange die sets in under 10 minutes. Additionally, the machine is designed to run multiple processes in an automated, unattended manner, allowing for it to run unattended during extended production periods. Overall, ESEC 2008HS3PLUS is an impressive die attachment tool that provides speed, accuracy, and flexibility coupled with a powerful data management capabilities. It is sure to revolutionize die attach operations and provide a reliable solution to all your production needs.