Used ESEC 2008 HS3 Plus #9360096 for sale

ESEC 2008 HS3 Plus is a die attach machine designed for high speed attaching of dies to substrates and IC packages in a wide variety of applications. It features a large working area of 8" x 8" and has a 6-axis robot arm with a solution at its end designed to handle multiple substrates and types of packages. The robot arm is driven by an advanced servomotor drive technology, with a high resolution positioning equipment and a flexible operating system that offers several levels of speed control enabling it to handle multiple substrates with superior accuracy. The machine employs a state-of-the-art vision unit to precisely align dies to the substrate while maintaining bonding accuracy and repeatability. The vision machine is coupled with a programmable die pickup tool that allows users to define and set up the orientation and type of dies to be attached. This ensures that each die is correctly positioned and correctly oriented. The asset also eliminates the need to manually check and adjust the die attachment process and significantly reduces defects due to a misaligned die. ESEC 2008HS3PLUS also features a reliable, high-speed die bonder and heated die attacher. The bonder is equipped with a nozzle clamping model that ensures the nozzle does not distort or move during the heating and sealing process, resulting in an exceptionally reliable and stable bond. The heated die attacher is also fitted with a nozzle-clamp mechanism, protecting the nozzle from movement and ensuring accurate die positioning. 2008 HS 3 PLUS is further equipped with a reliable, high-speed printing equipment that produces clear, high-resolution prints with a wide format, accommodating different packages and substrates. The printing system also offers various options, including multi-track printing, double line printing, and numbered printing. The machine is also easy to maintain and offers users a variety of service options, including online and off-line troubleshooting. The operator interface is designed to provide maximum ease-of-use and the unit offers advanced monitoring, data-logging and reporting capabilities. Overall, ESEC 2008 HS 3 PLUS is a highly advanced die attacher that provides high-speed, precise and reliable attachment of dies to substrates and IC packages, suitable for a wide range of applications. The advanced vision machine, robust bonder, heated die attacher and versatile printing tool, coupled with its user-friendly interface and monitoring capabilities, deliver reliable and efficient performance.