Used ESEC 2008 HS3 Plus #9360781 for sale

ESEC 2008 HS3 Plus is a die attacher specifically designed for attaching dies to semiconductor wafers. The machine offers a combination of features that make it an ideal tool for a wide range of semiconductor fabrication processes. The machine features an advanced automated operation that allows users to quickly and reliably attach dies to wafers, ensuring a secure connection with no damage to the dies or the wafer. It is designed for use with Wafer Post - a proven solution for attaching dies to wafers. The automated process requires no user intervention and offers a reliable connection every time. ESEC 2008HS3PLUS is highly accurate and offers a wide range of features. It can quickly attach a range of different sizes of dies onto a wide range of wafer sizes. It is equipped with a precision optics system and a mechanical system that ensures accurate alignment of the die onto the wafer. This ensures that there is minimal mismatch between the die and the wafer and reduces the chances of any damage or misalignment. 2008 HS 3 PLUS also offers a wide range of configurations for the die attachment process. These include options for fast, slow, or full-time bonding of dies, as well as multiple die sizes and spacer types. This provides users with the flexibility to choose the optimal setup for their application. 2008 HS3 Plus has an integrated touchscreen display that allows the user to easily view and monitor the die attaching process. It is also equipped with a range of safety features, including a range of alarms and an emergency stop button. Overall, ESEC 2008 HS 3 PLUS is designed for use in a wide range of semiconductor fabrication processes and provides users with a reliable, accurate, and repeatable die attaching process. It is easy to use and is highly configurable, allowing users to tailor the die attaching process to their specific requirements.