Used ESEC 2008 HS3 Plus #9360782 for sale

ESEC 2008 HS3 Plus is an advanced die attacher designed to reduce the time and cost associated with attaching dies. It features a high speed triple head solution with a two-finger mechanism and a pneumatically driven press. This three-headed system allows for a maximum of 48,000 die attach operations per hour. The press is equipped with an auto-feed system that is adjustable for die placement accuracy and a high-speed stamp head for faster die placement and bonding. Additionally, it offers dynamic control, which further increases the speed and accuracy of the die attachment. ESEC 2008HS3PLUS features a modular design, allowing for customization and improving overall flexibility and efficiency. The controller features an easily readable LCD which displays information such as production information, speed and die placement accuracy. It can be programmed to produce patterns of bias and grid densities with a high degree of precision. The die attacher is capable of handling 556µm to 604µm pitch for high-density die packages, as well as 556µm to 1032µm pitch requirements, offering a wide range of options for various project needs. It can also attach die packages with a low to high bonding pressure of approximately 500psi. Additionally, 2008 HS 3 PLUS boasts a very low failure rate, with a pick and place mechanism that helps to prevent damage to the dies. In terms of safety, ESEC 2008 HS 3 PLUS is designed with appropriate safety guidelines, offering a range of protection including a ground bar, a dual E-clamp circuit breaker, emergency stop to prevent physical damage, and a raised cover plate to protect against abrasive dust. Overall, 2008 HS3 Plus is an advanced, efficient and reliable die attacher for high-precision die package applications. With a fast, adjustable auto-feed system, a high-speed stamp head and the ability to manage both low and high pitch requirements, this die attacher can offer a level of accuracy and efficiency that is difficult to match.