Used ESEC 2008 HS3 Plus #9360793 for sale
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ESEC 2008 HS3 Plus is a high-speed die attacher designed for the die attachment of very fine pitch devices. It features a revolutionary high-speed taping equipment that enables the device to be used for a wide range of layouts and applications. The device provides quick and accurate taping with an amazing repeatability and precision of +/- 0.0005 inches (0.01mm). It is capable of handling substrates with leads as small as 0.2 mm pitch and can attach up to 6 dies per minute. ESEC 2008HS3PLUS is equipped with a range of superior features to ensure precise die attachment every time. It is equipped with a built-in vision system that accurately identifies the device's position, allowing for an exact repeatability when attaching dies. It is powered by a 3-axis servo-driven robotic-arm, which is fast, precise and reliable. The device can also be operated via Teaching Wizard software, which is equipped with easy-to-use programming wizards and functions. 2008 HS 3 PLUS also features an advanced assembly control unit, which provides comprehensive monitoring and control of die-attaching operations. This unique control machine ensures the device is always running at optimal conditions, and can be used to monitor, analyze and track production quality and performance data. ESEC 2008 HS 3 PLUS is built to last, as its design is built on a rugged metal frame with load-bearing capacity of 50 kg (110 lbs). The device is designed to operate at temperatures of -5°C to +45°C (+23°F to +113°F). Its LCD monitor has a resolution of 640 x 480 pixels (1024 x 600pixels optional) and a 7-inch touchscreen for easy data input. 2008 HS3 Plus is designed to save time and money, as its advanced design allows for the fast attachment of complex devices within short cycles. With its superior performance, compared to traditional die attach machines, it is the ideal choice for high-volume manufacturers. Whether for the attachment of large or small components it offers a cost-efficient, time- and labor-saving solution.
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