Used ESEC 2008 HS3 Plus #9389596 for sale

ESEC 2008 HS3 Plus package is a high-performance, cost-effective die attacher designed for the joining of semiconductor die to package substrates. It is an ideal solution for flip chip assembly in various applications, including cell phone and computer chips, memory, microprocessors, etc. The HS3 Plus is built on the powerful Five-Axis ESCORT Technology to enable accurate and precise die attachment with minimal misalignments. It is equipped with five, servo-controlled X-Y-Θ-Z axes that offer precise control and dynamic adjustability to help meet high-volume production standards. The system is also capable of custom attachment configurations to enable a wide range of process parameters for attachment. It allows for precise control of die standoff and Z-axis placement. In addition, the HS3 Plus package is also outfitted with advanced hardware and software technologies for monitoring and optimizing process performance. This includes visual inspection detectors, a monitoring station for real-time temperature control, and an integrated die monitor for thermal monitoring and feedback adjustment. The HS3 Plus also includes automated functions for alignment, attachment, inspection, re-inspection, part cleaning, and part probing. It is capable of pre-attachment conformal coating, which provides improved strength and reliability of the die attach. Additionally, the system is optimized for fast-changeover and delivers quick repeatability on the placement of the die, even for complicated or high-volume production. The HS3 Plus offers quick downloads to the CCD detector for easy setup of the attachment parameters. In conclusion, ESEC 2008HS3PLUS die attacher is a powerful, cost-effective system that is designed to meet the most demanding production needs. It features five-axis ESCORT Technology, advanced hardware and software, and automated functions for alignment, attachment, and inspection. The HS3 Plus is an ideal solution for reliable and repeatable die attachment in a multitude of applications.