Used ESEC 2008 HS3 Plus #9395587 for sale

Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 9395587
Die bonder.
ESEC 2008 HS3 Plus is a top-of-the-line, high speed, precision die attaching equipment. This automated system is designed to provide higher throughput rates, save on labor costs, and ensure consistent, accurate attachment of dies in a wide range of packaging applications. With a maximum speed of 150K pieces per hour, the HS3 Plus is capable of large volume runs with little or no downtime. The HS3 Plus operates in three stages: pickup, alignment, and attachment. In the pickup stage, the unit uses vacuum and mechanical mechanisms to identify and pick up the desired dies from the feeder tray. During the alignment stage, the dies are precisely aligned with the board's die-pads before being transferred to the attachment stage. Here, a glue dispenser precisely applies a precise amount of glue to achieve a perfect bond. In addition, an automated inspection machine checks each die for defects before and after bonding. The HS3 Plus also incorporates user-friendly features to improve accuracy and production speed. The tool is equipped with a nozzle tracking feature, which allows the asset to automatically adjust its working parameters to accommodate for any variable adhesive density. Additionally, the model can be programmed to accommodate a variety of pressure ranges and is equipped with a sophisticated, yet easy-to-understand graphical user interface to simplify setup and make programming changes quickly. Finally, the HS3 Plus features advanced monitoring capabilities that enable users to precisely monitor the production process in real time. This includes a die-counting equipment, which records the total number of die attached, as well as reporting alarms and errors associated with ordering new dies, supplying glue, and cleaning the system. In conclusion, ESEC 2008HS3PLUS is one of the most advanced die attaching systems available in the market today. Its high speed, accuracy, and user-friendly features make it ideally suited for a wide range of automation and packaging applications. With its sophisticated monitoring capabilities and cost-saving features, the HS3 Plus helps companies achieve higher production speeds and improved efficiency.
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