Used ESEC 2008 HS3 Plus #9396178 for sale

Manufacturer
ESEC
Model
2008 HS3 Plus
ID: 9396178
Die bonder.
ESEC 2008 HS3 Plus is a professional die attachment equipment for semi-conductor device assembly applications. It is specifically designed to clinch high volume and critical components as part of an automated assembly process. The system uses a precision head positioning unit that allows the ability to quickly and accurately attach components from 0201 to 0330 packages. The HS3 Plus utilizes an E-select tool (electro-pneumatic) and can be programmed to optimized clutch-attachment force. It is capable of varying the force applied to the package based on heat, pressure, material and size. This versatility makes it suitable for applications in a wide range of industries. The HS3 Plus utilizes an advanced feedback machine that allows it to automatically adjust the force applied to the component in real-time, ensuring the best possible results without the need for manual adjustments. It is equipped with a four-axis precise head positioner which allows for small components like 0201 to be precisely placed on the substrate without any need for additional tooling. The tool is also engineered with a reinforced die attachment arm which improves its performance and stability. It is also covered by a special protection cover to ensure that users do not come into contact with any harmful elements. The asset is compatible with various types of dies, and the user can choose from a selection of die sizes to meet their specific needs. ESEC 2008HS3PLUS has a built-in laser marking model, which allows for features like product identification and inspection to be quickly and accurately identified. The equipment comes with a selection of powerful accessories which either come as standard or can be purchased separately. These include high-speed pick and place modules, soldering heads, rotary motors, and an SCF cable for power supply. This attachment system also includes an ultrasonic cleaner, auto balance compensation, and in-line wire feeder. The HS3 Plus is not only reliable and efficient, but also very easy to operate. The built-in user interface is intuitive and straightforward, and the unit can even be operated remotely. This flexible machine is also very compact and efficient, and requires a minimal amount of space for successful installation and operation. All of these features combined make 2008 HS 3 PLUS the ideal choice for any automated die attachment tool needs.
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