Used ESEC 2008 HS3 #293747545 for sale

ESEC 2008 HS3+ is a high-performing die attacher designed to provide a quick and precise method of attaching die to substrates. It features an automated vision-driven equipment to accurately position die on substrates. The tool also offers an automated, multi-step die placement system to precisely register die on any flat or curved substrate, and enables rapid and consistent die attach operations. 2008 HS3+ features a four-axis unit operated and controlled by a PC-based machine. It utilizes the latest vision technology to accurately locate, orient, and register die on substrates. The automated placement tool is designed to consistently produce die attach with accurate placement within ±1 mil. ESEC 2008 HS3+ also features an adjustable die placement force and temperature to ensure optimal mount and secure die on substrates. It also has a built-in Z-axis calibration asset to quickly measure substrate alignment during die attach. The four-axis motion is powered with a central cycle timer providing superior accuracy and repeatability. 2008 HS3+ comes equipped with a high-powered vacuum model which has adjustable pressure to secure die onto substrates with powerful holding force. Its intuitive software interface allows operators to easily program and configure placement functions with only a few clicks of the mouse. The machine also has the capability to be integrated with multiple vision systems for improved accuracy. ESEC 2008 HS3+ is designed with safety and convenience in mind. Its open design allows operators to easily access the automated placement equipment without fear of hazard. It also has secure enclosure to prevent hazardous particles. The die attach system also minimizes vibration and thermal drift to ensure minimal thermal-cycled die attach, providing a reliable, safe and productive attach environment. Overall, 2008 HS3+ is a reliable, high-performance die attacher designed to provide accurate, efficient, and safe die attach operations. Its adjustable die placement force, adjustable pressure, reliable motion, and intuitive user interface make it a great choice for attaching die on substrates.