Used ESEC 2008 HS3 #9266833 for sale

ESEC 2008 HS3 is a high-speed die attacher designed for high-volume applications in the semiconductor and electronics industries. The HS3 utilizes an efficient die-picking mechanism, providing a throughput of up to 10,000 parts per hour. The die picker is designed for a wide range of die sizes and substrate heights, with auto-adjustment of working height. The picker arm utilizes an intermittent motion with a tandem electric linear actuator to ensure precise placement of the die on the substrate. Combined with a simple adjustable aerial platform, this equipment allows for minimal setup and easy integration into existing production lines. An additional screw feeder allows for automated die feeding, minimizing operator intervention. The HS3 also features a vision system that enables fully automated placement of the die on the substrate. This unit utilizes a high-resolution camera with superior resolution and depth of focus, allowing for automated die rank/orientation detection along with binary images for tooling verification. The camera is integrated with a dual-sided camera mount, which allows for full control of the picker arm to achieve accurate placement of the die, regardless of the substrate height. The HS3 also has an optional die bonder option which includes an XYZ-axis center, a built-in cutting machine, and the ability to detect two die heights simultaneously. With this option, the HS3 can be successfully deployed for both die attach and die-bond applications. The HS3 is built on an open-architecture platform, allowing for easy upgrades in the future. With a user-friendly control panel, automated calibration routines, and an adjustable working table height, ESEC 2008HS3 is a reliable and robust machine, which can help optimize efficiency and increase productivity.