Used ESEC 2008 HS3 #9268603 for sale

ESEC 2008 HS3 is a high-speed die attacher designed for fully automated die attach operations. It is a fully integrated system with an integrated pick and place handler, die aligner, and thermosonic wirebonder. It is designed to provide the user with the highest levels of consistency and repeatability throughout die attach operations. The HS3 is capable of delivering a probing speed of up to 50 die per second, and can place die down to a size of 0.25mm. It operates on an electronic programmable logic controller (PLC), and is equipped with advanced vision algorithms to ensure alignment accuracy and process reliability. The HS3 also includes advanced roll-over adjustment that allows for the adjustment of bond pitch, as well as 15 trim adjustments for wirebond and bond offsets. The time required for programming and setup is reduced by up to 50%, due to its easy-to-use software interface. The HS3 is built for high reliability and ease of maintenance, with features such as auto-diagnostics, preventive maintenance digital display, and a single-point calibration facility. These features ensure that the machine remains running at peak performance, and helps the operator reduce downtime for repairs. The HS3 is also designed for integration with other machines in an automated production line. It can be effortlessly integrated into existing die attach lines, including systems that use robot handlers. It is also compatible with almost any production environment, providing a seamlessly interfaced production line. In summary, ESEC 2008HS3 is a high-speed die attacher designed to provide the highest levels of process reliability and consistency. It is capable of delivering reliable positioning of die down to 0.25mm, with advanced features such as roll-over adjustment and trim adjustments. Furthermore, it is built for ease of maintenance and integration into automated production lines, making it a great choice for any die attach operations.