Used ESEC 2008 hSC3+ #9199547 for sale

ESEC 2008 hSC3+ die attaching equipment is a fully automated system for binding die to a substrate and forming a hermetic seal. It achieves a uniform die attach over a wide variety of semiconductor devices with a wide range of component densities, meeting the most stringent environmental requirements. The unit uses a patented laser bonding process to achieve accurate die placement with superior repeatability and reliability. It incorporates a high power spinning laser that is coupled with a vision-guided robot that inspects, positions, and controls die placement. It is capable of handling die sizes down to 0.5mm x 0.5mm and substrates in various sizes up to 200mm x 200mm. The machine has a user friendly graphical interface and automated features designed to simplify the operation. The automated features include positional alignment, fiducial inspection, substrate preparation, die dispensing, substrate scanning, laser bonding, and die testing. The tool also features advanced technology in error detection and correction to ensure accurate die placement. 2008 hSC3+ is equipped with heuristics-based vision-guided robotics for failsafe die placement. It can perform continuous die attach operations without interruption, even when die punches are not properly aligned or die placements are out of tolerance. The self-advertisement feature speeds up die placement and reduces the operator's need to make frequent manual adjustments. ESEC 2008 hSC3+ has a modular design that is easily scaled up for larger substrates and can be expanded to incorporate additional die handling and other auxiliary equipment. It is suitable for high-volume production and is capable of attaching up to 40mm/s. 2008 hSC3+ asset is designed for ultimate reliability. It is equipped with automated temperature control, automatic cleaning and calibration routines, and failsafe safety systems. Additionally, it offers an optional die placement verification model to ensure the highest yield in the most demanding applications.