Used ESEC 2008 SC #9299441 for sale
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ID: 9299441
Wafer Size: 8"
Die bonder, 8"
Reel to reel
Productivity: Up to 8,000 UPH
Bonding accuracy: 35-m @ 3 Sigma
Die size: 10 mils (0.25 mm) to 1" (25.4 mm)
Process modules:
Compact curing system
Fast and flexible programmable dispenser
Vision systems:
Parallel pre-bond Integrated Quality Control (IQC)
Post-bond Integrated Quality Control (IQC)
Material handling:
Reel in / Reel out
Buffer
Various options:
Solution (Plus3), 12"
Wafer mapping package
Wafer map conversion package
In line curing:
(2) Sections with (8) zones temperature (Individual for each section)
Each zone setting up to 230°C.
ESEC 2008 SC (or Self Closing) is a die attachment equipment designed to improve production throughput and quality assurance for automotive stamping facilities. It is a light weight, self-contained die attachment system, utilizing two independently actuating clamping arms to securely transfer sheet material to and from the die. This attachment unit is perfect for situations where space or weight limitations are of concern, since 2008 SC does not require a CAE or a separate power source to operate. ESEC 2008 SC is available in a variety of sizes and configurations to match the needs of any industrial application. It features an adjustable clamping machine that secures the die to the sheet material in an effort to ensure that each part is reliably produced. The tool utilizes a heavy-duty base support and two independent, self-closing arms that provide superior clamping force to securely clamp the die and the sheet material for reliable transfer. The die clamping asset is adjustable, allowing the user to accommodate various sheet material thicknesses. In addition, 2008 SC is equipped with an integrated safety model that monitors key operational parameters to ensure safe operation. This equipment is designed to help minimize premature die and tool failure, as well as to reduce the risk of operator injury due to gripping errors. ESEC 2008 SC also includes a power safe approach feature and emergency override, in case of a power failure. 2008 SC is designed for high-speed applications that require accuracy, precision, and repeatability in the transfer process. The system is designed to transfer up to 10 times faster than traditional die attachment methods, and it requires minimal maintenance and adjustment. By increasing the speed of die transfer and reducing downtime, ESEC 2008 SC significantly reduces the overall production costs of an automotive stamping facility. Overall, 2008 SC is specifically designed to provide superior performance and reliability in automating the die attachment process, helping to improve production throughput and quality assurance while minimizing costs associated with die and tool failure.
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