Used ESEC 2008 xP #196571 for sale

ESEC 2008 xP is an industrial-grade die attacher featuring a high-precision placer and an efficient, safe, and user-friendly design. This innovative machine is designed for automated die-attaching tasks related to a wide range of semiconductor components such as chips, ball grid arrays, and flip chips. ESEC 2008XP is well-suited for progressing automated processes in production lines and ensuring that each application receives the exact die that it needs. The die attacher features a precision die-placing equipment, adapted from an industrial servo system, providing excellent positional accuracy and repeatability. It is capable of placing circuits and components in packages with an absolute accuracy of less than 0.01 mm, far exceeding the quality that can be obtained by manual methods. This makes it ideal for demanding applications such as flip chip attach and RF module packaging. The machine is capable of handling dies with precision and speed. It can run at speeds up to 6500 placements per hour with a repeatability option of 10 microns. 2008 xP also features a user-friendly design that simplifies the operator's job and reduces the chances of errors. It has an easy-to-use graphical user interface (GUI) delivering a simple yet intelligent control solution. The design also includes a sophisticated safety unit which ensures that the machinery is operated safely and efficiently. The safety shut-off feature is activated in the event of an emergency, and the machine can be locked out to prevent unauthorized tampering with the machine. Overall, 2008XP provides a reliable and versatile solution for attaching dies to semiconductor components. Its high precision placement tool and safety features make it a reliable and cost-effective choice for automated processes. The user-friendly design ensures that the operator can quickly complete tasks with minimal errors.