Used ESEC 2008 xP #198472 for sale

ESEC 2008 xP die attacher is a state-of-the-art machine used for the attachment of semiconductor wafers or dies onto substrates. It is capable of handling the entire attachment process for medium to high-volume productions, making it an ideal solution for wafer and die assembly. The xP is equipped with a pneumatically controlled die head utilizing a customizable die attach program for accuracy and repeatability. The head has seven axes of motion, allowing for the positioning of the die on the substrate with great precision. The head is also equipped with an integrated vision equipment that performs process feedback and ensures accurate die placement. The xP offers adjustable process parameters for a variety of attachment techniques. A high-speed, programmable hot gas reflow system is also provided, allowing for the attachment of thermal sensitive die. Additionally, the xP has a self-centering nozzle that facilitates the accurate delivery of adhesive and the attainment of a uniform bond. The xP is equipped with an intuitive user interface and an integrated communications unit for remote diagnostics. The machine performs self-monitoring and has optional data logging capability. The xP also has an Open-Closed-Loop control that allows for the adjustment of process parameters within the integrated machine. The xP machine is a reliable and durable device designed for high-volume production. It is equipped with an advanced control tool that ensures stable operation amidst fluctuating environmental conditions. It is compact in design, measuring only 700mm in width, 800mm in depth, and 1700mm in height. ESEC 2008XP die attacher is an ideal solution for medium to high-volume production of dies and wafers and is equipped with a plethora of features that enable it to consistently deliver precise results. It's user friendly interface and decentralized control asset further add to its appeal, making it a reliable and cost-effective choice for semiconductor factories.