Used ESEC 2008 xP #293585635 for sale

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Manufacturer
ESEC
Model
2008 xP
ID: 293585635
Vintage: 2004
Die bonder (2) Stacks for LF input Stack for unloading interleaves Heatable indexer: (3) Heating zones (8) Wafer cassette handlers (8) Wafer tables Dispense unit Substrate Dispense Post bond inspection Magazine output No magazines 2004 vintage.
ESEC 2008 xP is a high-performance die attacher, designed to effectively and accurately apply a variety of different die components in a very fast and efficient manner. The die attacher is built around a CAM-style automation equipment and utilizes an innovative 'bond head adjustment' that allows for precise application of the bonding agent. This allows the production rate to be higher and at the same time, ensures quality control over the final product. ESEC 2008XP die attacher uses advanced hardware and software to receive precise measurements and parameters from the user. This data is used to adjust the bond-head accordingly so that precise amounts of adhesive and force are used. The data is then sent to the xP attacher's motion-controlled unit which drives 4 robotics arms, each of which are equipped with a specialized die-application head. The arms are programmed to move precisely along the surface of the die to ensure the most accurate application of the adhesive. 2008 xP is also equipped with a vision system which provides visualization of the adhesive application and automatically makes adjustments for optimal adhesion. This feature improves process accuracy and increases the productive rate. The Vision Unit also allows the die attacher to scan the die for the presence of adhesive and properly adjust it to the surface of the die. 2008XP can also be integrated easily into existing production systems. It comes with several communications ports to allow for connection to external equipment. Using a serial port connection, users can also connect their PC Over (PCO) controller or PC/104 bus to control the die attacher. This provides a direct pathway of data flow that allows users to easily monitor and adjust the process as needed. Overall, ESEC 2008 xP is a reliable and accurate die attacher that allows users to quickly and efficiently attach die components with superior accuracy. Its advanced CAM-style automation, precision motion controlled unit and intuitive Vision Machine provide users with an easy to use, quality controlled solution that can accommodate a variety of different die components. The die attacher also integrated seamlessly into existing production systems, allowing for fast and productive automation.
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