Used ESEC 2008 xP #293629296 for sale

ESEC 2008 xP is a high-performance die attach equipment developed by ESEC Corporation. It is designed to deliver reliable, high-speed, accurate attachment processing for die, bump, and substrate materials. The system is equipped with a Direct Diode Laser for precise control for each application. ESEC 2008XP features adjustable optics that offer precise control over the laser spot size and profile. This ensures that the best possible attachment is achieved. The adjustable spot size is especially beneficial for die attachment as it can reduce the level of stress and warping of the die that can occur during attachment. 2008 xP is designed for accurate, repeatable positioning of the die and substrate materials. The accuracy of the machine is due to its linear motor technology, which enables the axis speeds of up to 1000mm/sec and acceleration that exceeds 10G. This provides rapid processing times while maintaining a high quality of results. The 8 million dot/meter camera unit ensures accurate alignment and ensures the die and substrate materials are accurately positioned. This guarantees that each die is placed with a high degree of accuracy and repeatability. 2008XP is a versatile machine, capable of handling die sizes up to 8x8mm. The machine can be integrated into existing production lines, allowing for a smooth transition and cost savings. The optional auto-loader feature eliminates the need for manual loading of die, saving time and labor costs. ESEC 2008 xP is equipped with a modern control tool, making it easy to program and use. It is also optimized for network connectivity, allowing for easy connection to existing networks. Furthermore, it has an electric systems enclosure for enhanced safety and energy efficiency. Overall, ESEC 2008XP is a powerful, reliable, and precise die attach asset. By offering superior performance and quality, 2008 xP is an ideal choice for high-volume, high-accuracy die attachment.