Used ESEC 2008 xP #293645976 for sale

ESEC 2008 xP is a high-speed and precise die attacher equipment for modern chip production. This system is specially engineered for rapid, reliable and repeatable die-to-package (D2P) and die-on-tape (DOT) attachment. It is designed for high-precision die placement in critical hotspot area assemblies designed with ultra-thin dies and packages up to 12 mil thickness. This unit is capable of attaching dies with varying sizes and pitches so that precise chip placement can be achieved. Besides the precise and precise placement of chip dies, ESEC 2008XP also offers extremely precise single die and wafer-level lapping processes. This machine also offers a die-transfer technology that can handle up to eight 10 mil dies in parallel. The die transfer technology also allows for accurate placement of thinned dies, ensuring uniformity and repeatability throughout. 2008 xP also features an advanced off-line software programming and displacement sensing tool for precise chip placement. This asset allows for precise and repeatable positioning of dies on both D2P and DOT packages. It also features patented double-break lip-dwipe technology, which greatly reduces relative motions between the die and the substrate when transferring die from or to the package. 2008XP is equipped with high-performance image recognition technology that offers fast and precise thermal imaging for die-level or wafer-level chip placement. Resulting images are then analyzed for gap compensation, wafer alignment, tilt and thinning of dies, resulting in maximum placement precision and repeatability. The model also offers automated thermal head contouring and indexing tools which help optimize die placement accuracy and prevent misalignment of chips. ESEC 2008 xP is designed to meet the highest production requirements and is certified for ISO9001.