Used ESEC 2008 xP #293753904 for sale

ESEC 2008 xP
Manufacturer
ESEC
Model
2008 xP
ID: 293753904
Wafer Size: 6"
Vintage: 2002
Die bonder, 6" 2002 vintage.
ESEC 2008 xP die attacher is a versatile and reliable die attach machine designed for use in a range of electronic assembly processes. It offers great flexibility in the use of equipment and accessories, enabling simple and effective handling of a wide variety of die shapes and sizes. The machine features a modular design that includes an upper cabinet to contain the necessary components and a reversible die press mechanism, the latter of which can be used to accommodate horizontal and vertical die placement. The press head consists of a vacuum chamber and shielding cover, while an advanced placement head provides precise control over each step of the die placement process. With a total precision of 0.01mm, the head can be adjusted to within 0.03mm accuracy. Other components of the die attacher include a selective dispenser for precise die-size selection, a multi-clamping mechanism for precise movement of the die during placement, and a heated manifold to facilitate removal of flux residue. The machine is able to control die placement pressure up to 2000N, allowing for proper adhesion at temperatures up to 400°C. The intuitive design of the machine requires minimal operator training and is easy to integrate into various assembly lines. With a fast cycle time of 1.4s/die, it enables high accuracy and process repeatability. Additionally, the integrated monitors measure internal vacuum levels and target die head pressure, ensuring the utmost safety of operators. Due to its precise operation and high throughput, ESEC 2008XP die attacher is an ideal solution for a range of assembly tasks, providing outstanding results with minimal cost and time expended. With its advanced features and well-thought-out configuration, it is an excellent choice for any electronic assembly application.
There are no reviews yet