Used ESEC 2008 xP #293753905 for sale

ESEC 2008 xP die attacher is a fully automated semi-conductor die-bonding system designed for highest precision and accuracy. This advanced device offers unparalleled flexibility in both singulation and placement operations, providing the ultimate in versatility and quality assurance. ESEC 2008XP utilizes two independent vision systems which provide pixel-perfect positioning, placement and singulation of each die component. The integrated high resolution cameras analyze the coordinates of each die, as well as track and validate movement and placement of the component. The device is capable of automated feed-and-tension sensing, as well as precise force control to ensure high quality results. High accuracy is ensured by the precise position monitoring of each die, as well as real-time precise alignment with the die attach area. 2008 xP is equipped with an advanced bonding head, designed for maximum speed and reliability. The device utilizes a proven hot-bar bonding technology, providing precise and precise pressure control for precise and efficient bonding of each die. The attach head is integrated with an Anti-Stain Dispense System which identifies and neutralizes any particulates present on the surface of the die, helping to ensure high quality performance. 2008XP is designed for low maintenance and service requirement, providing an advantage in cost of ownership over many other die-bonding systems. The intuitive interface reduces configuration time, allowing for quick setup and minimal downtime for maintenance. The self-diagnosis feature further reduces downtime by quickly identifying any potential problems before they become actual issues. Finally, the device is equipped with a temperature-controlled soldering station, ensuring reliable and precise termination of chips and boards. In sum, ESEC 2008 xP delivers the highest accuracy, reliability and speed of any die attach system available. By providing automated process control and precise control over each die, ESEC 2008XP helps to lower operating costs and improve overall yields. With a reputation for superior quality and reliability, 2008 xP is an ideal solution for any high volume, precision oriented semiconductor facility.