Used ESEC 2008 xP #293771155 for sale

ESEC 2008 xP die attacher is an automated machine used for die attaching applications in the semiconductor industry. It is designed with a precision-engineered tooling equipment capable of attaching a wide variety of die sizes and shapes with high repeatability accuracy, while allowing for lower end-of-line die handling costs. The system is modular and allows for easy integration into existing die handling and material handling systems. ESEC 2008XP features a large work envelope to accommodate a range of die sizes and shapes. The pack platen automatically adjusts for tooling and die height conditions, providing for fast, accurate die placing. The unit is also equipped with an intelligent die sorting compression machine that ensures that dies are correctly oriented and slide correctly into position. This prevents damage to the die during the attaching process. The machine's advanced control tool is easy to use and allows for high teleserviceability, eliminating downtime and reducing maintenance costs. The machine can be accessed remotely, allowing users to access information about the process and make changes quickly and easily. 2008 xP offers high-speed throughput and is designed with several different operating modes. The high-speed continuous mode is designed for applications that require a large number of die packages to be attached in a short time. The low-speed batch mode is designed for batch attaching operations, allowing users to attach a few die packages at a time. 2008XP offers a variety of options to control the rate of die pick up, placement and release, allowing the user to modify the asset to the specific requirements of each application. The die attach tooling, feed model and dispensing equipment are all designed to provide maximum accuracy and consistency of die placement, while minimizing cost and cycle time. Overall, ESEC 2008 xP is a high-performance die attacher that provides a unique solution to die attaching and other material handling applications in the semiconductor industry. Its modular design, efficient operation and open controller architecture make it ideal for production, test, and prototyping environments. ESEC 2008XP is a cost-effective solution to automated die attaching.