Used ESEC 2008 xP #9119582 for sale

ESEC 2008 xP die attacher is a versatile, highly reliable, high-performance pneumatic die attaching equipment specifically designed for the semiconductor industry. This top-notch system operates on a cycle time of less than two seconds on average and provides a maximum die attach speed of 6,800 CPH. The unit consists of two main components: the die attacher and the die control unit. The die attacher is comprised of a pneumatic power supply, a power nozzle tip, and a pick-and-place module for gripping and transferring semiconductor dies. The machine also includes a pneumatic control valve, a temperature controller, and an ultra-flexible air supply. The die control unit contains a multi-functional touch screen interface with diagnostics and job tracking capabilities. ESEC 2008XP die attacher was designed to optimize the accuracy and speed of the die attach process. The tool is equipped with dual-axis motion control for precise die placement and offers a range of control options to ensure the best die placement results. The integrated pick-and-place module offers excellent gripping strength and high-speed operation for quick and seamless die transfer. This machine also features an advanced temperature control asset with built-in thermal safety features to protect the model against overheating and other potential damage. In addition, the equipment's built-in air filtration helps reduce particles contamination and protect against system damage. Furthermore, 2008 xP die attacher is designed with easy maintenance in mind, and its user-friendly interface allows for quick and easy operation. 2008XP die attacher is an outstanding machine that helps streamline and improve the production process. With its high-speed, reliable, and accurate performance, excellent thermal protection, and simple operation, this great unit makes die attaching easy, efficient, and cost-effective.