Used ESEC 2008 xP #9137647 for sale

ESEC 2008 xP Die Attacher is a state-of-the-art die bonding tool used in the semiconductor industry. It is designed for high-volume production, offering a reliable solution for die attachment and die micro-bonding. This versatile equipment is capable of attaching and/or micro-bonding die onto substrates in a wide range of processes, including surface mount (SMT), flip chip, and COB (chip on board). The machine features a precision die placement system, adequate vision guidance, and high speed thermal micro-bonding. Furthermore, hot bar tools are available for flip chip attach and multiple die attach applications. The unit also offers a wide range of attachment options, allowing it to be used for various substrate sizes, from 0.3mm ~ 0.6mm to 1.5mm ~ 10mm. It is also capable of meeting the most stringent demands in terms of placement accuracy and yield. In terms of speed, the machine is rated up to 80 die per second standard, or up to 100 die per second with optimized processing. In terms of accuracy, ESEC 2008XP Die Attacher is capable of ± 0.5 µm precision placement and ± 1.0 µm sub-pixel accuracy. It can also achieve true positional accuracy of ± 0.3 µm to 1 µm (depending on bond size and edge detection). This performance allows the tool to achieve unparalleled repeatability and stability in production process., The asset also comes with integrated features and a host of specialized accessories, apart from the main die descension model. These include a programmable die loader, die engine, centering jigs, programmable boundary sensor, and dual optical registration tool. In addition, the tool comes with a number of optional features, such as an integrated digital signal processor (DSP) for precise PID parameters to ensure the consistency of the die attach process. In summary, 2008 xP Die Attacher is a high-precision and reliable die attach equipment that is suitable for high-volume production with consistent and reliable results. The tool boasts a wide range of features and attachment options to support various substrate sizes and processes, with the ability to meet stringent accuracy and yield requirements. Furthermore, it comes with a number of integrated and optional features to ensure efficient operation and optimal performance.