Used ESEC 2008 xP #9246086 for sale

ESEC 2008 xP Die Attacher is a revolutionary automated die attach machine designed to enable efficient, high-speed die bonding of integrated chips used in the latest automotive, consumer electronics, medical, and aerospace applications. The xP Die Attacher sets a new standard of productivity with its powerful features and high precision. The xP Die Attacher offers automated die handling with quick index time and precise pick and place accuracy. It is equipped with a patented die attach head design and vacuum pick and place blades that guarantee accurate placement of devices. The two-axis CCD image equipment ensures precise alignment, which eliminates the need for device adjustment. Its robust die attach head is designed to provide uniform solder joints with minimal waste of die attach materials. The xP also offers four unique die attach modes, including manual, semi-automatic, full-automatic, and LPC (Low Pressure Changeable) that enable optimal die attachment based on product requirements. The xP Die Attacher is also equipped with a high-resolution color LCD touch screen, providing a simple and intuitive user interface for easy operation and operation management. It also has a self-diagnostic system that quickly detects any potential issues and improves machine performance. The xP Die Attacher is capable of bonding a wide range of die sizes, from 0.2 mm to 1.5 mm, and has a maximum cycle time of 2 seconds with production speeds of up to 700 die per hour. Its high precision and robust design make it a reliable solution for die attach applications. In addition, the xP Die Attacher is equipped with advanced safety features, such as an anti-collision unit that prevents faulty die movements and a vision machine that monitors operations for safe and reliable operation. It is compatible with solder capability, thermocompression, and urethane bonding processes. Overall, ESEC 2008XP Die Attacher is the perfect choice for any die attach company looking for an automated, reliable, and flexible solution to die attach various integrated circuits. Its powerful features and high precision ensure reliable performance and maximum productivity.