Used ESEC 2008 xP #9329200 for sale

ESEC 2008 xP is an automated die-attaching equipment from ESEC, a leading semiconductor equipment manufacturer. This system is designed for use in handling die-attach, or the method of attaching dies, or individual pieces of an integrated circuit, to a substrate. ESEC 2008XP is a high-performance platform that offers reliable die-attach accuracy, superior process control, and proven scalability. ESEC 2008 xPsystem features a versatile feeder unit supporting pickups of die, die-attach adhesive, and substrate. The die-attach adhesive is placed onto the substrate with a dispenser before the die is then placed onto the adhesive. The position of the die is carefully determined by a vision machine, ensuring accurate placement of the die onto the substrate. 2008 xP also offers a broad selection of force ranges to suit a variety of die-attach processing needs. This includes forces of 0-6 N, 0-20 N, and 0-50 N. 2008XP tool can also attach dies at multiple heights for improved productivity. Manual control parameters are available to ensure error-free die attach and deliver consistently good quality and high yields. Examples of these parameters include dispense and die placement force control, adjustability in the bond gap, press-down time, temperature, force, bonding speed, and more. ESEC 2008 xP die-attaching asset offers fast setup and easy maintenance with its modular design. This model also has an intuitive user interface that enables users to quickly establish the best process parameters for their application. Finally, ESEC 2008XP is backed by ESEC comprehensive customer service and support. Overall, 2008 xP is an ideal die-attaching equipment for those seeking reliable, precise, and repeatable die-attach production. It offers a broad range of features to meet the needs of multiple industries, such as optoelectronics, automotive, and medical devices. Moreover, the system's intuitive interface, fast setup, and scalability make it an excellent choice for meeting die-attaching needs.