Used ESEC 2008 xP #9359250 for sale

ESEC 2008 xP is a die attacher that is designed to provide efficient and reliable application of dies onto various surfaces. It is ideal for both medium- and large-sized chip production, as well as for other demanding applications. ESEC 2008XP is equipped with a range of features that make it an ideal tool for attaching a wide variety of dies to substrates. 2008 xP is equipped with a nozzle-based temperature control equipment that accurately and efficiently control the temperature of the die-attachment process. This ensures minimal damage to the die as it is being affixed to the substrate. Moreover, an integrated controller allows the operator to set the parameters of the process, including the temperature, the pressure, and the application rate of the adhesive. 2008XP's nozzle is designed to be integrated with existing equipment, and is also capable of accommodating multiple dies. The compact design of the nozzle is specifically optimized for use in production applications, with its small footprint ensuring ease of integration into production lines. Additionally, the nozzle's construction is specifically designed to increase the reliability of the die-attachment process, resulting in less downtime due to sudden nozzle failure. In addition, ESEC 2008 xP is equipped with an adaptive heat-control system, which monitors the temperature of the dies during the application process in order to ensure maximum efficiency. This is an especially useful feature in the large-scale production of chips, where high temperature control and uniformity ensures uniform results. ESEC 2008XP also features a range of safety features. The nozzle is designed with a built-in safety shield which prevents any splashing or leakage of adhesive or other hazardous materials, while the integrated motion control unit prevents the nozzle from unexpectedly spraying the substrate. 2008 xP is also designed for user-friendliness, with an easy-to-understand digital readout and status indicators that provide clear and concise information about the current status of the process. Moreover, it is equipped with an easy-to-clean nozzle, and the fast reloading machine allows for quick and efficient changeovers between die applications. Overall, 2008XP is a reliable, easy-to-use die attacher that is designed for efficient and accurate die-attachment for a wide range of applications. The advanced features and safety mechanisms ensure that the process is effective and reliable, and the user-friendly interface allows for quick and easy setup and use.