Used ESEC 2008 xP #9389599 for sale

ESEC 2008 xP die attacher is an automated die attaching equipment designed for medium to high volume applications requiring performance and flexibility in a compact package. The system features a highly reliable and robust CCD (charge-coupled device) vision unit and an intuitive, easy to use graphical user interface for programming and monitoring machine functions. The tool incorporates a dual axis XY die aligner with an integrated vision controlled feed trough for the die mounting. The die attach heads are designed to ensure accurate and reliable positioning of the die in any orientation. The imager provides high-resolution images of the entire attach process which facilitates the production of perfect die placements for each product. The die attachment process is controlled by an integrated PC-based software package that enables the operator to program the asset and monitor the attach process. The software includes a range of features including batch programming, calibration profiles, error alarm handling, and data logging. ESEC 2008XP attaches die to a wide variety of substrates, including FR4, IMF, and MPO. It is capable of mounting die with a size ranging from 0.8mm to 8mm. The model uses a highly precise and repeatable needle attach process which permits the manipulation of small die at high speed. 2008 xP also has an integrated x-ray imaging equipment for precise die reinforcing. This feature ensures precise die placement and eliminates solder bridging and solder voiding. The system is equipped with an onboard cooling unit to help ensure that high quality, reliable attachments are achieved. 2008XP die attacher provides a compact and versatile automated machine that enables high volume die attach production with excellent quality and reliability. This tool ensures that users meet their mounting requirements and achieve the highest levels of quality and performance.