Used ESEC 2008 xP3 #293627551 for sale

Manufacturer
ESEC
Model
2008 xP3
ID: 293627551
Die bonder.
ESEC 2008 xP3 is an automated die attacher designed to provide flexible, high-speed die attach dispensing. It features a servo head assembly with two separate motion channels, allowing for both high throughput and precision accuracy over a range of die sizes and materials. The software-controlled equipment offers a wide range of options and features, including automatic die recognition, die-to-die distance control, gate resolution adjustment, and multiple motion profiles. The system also offers offline programming and diagnostic capabilities, allowing users to configure settings and troubleshoot potential issues ahead of time. ESEC 2008XP3 is capable of dispensing between .5 and 3.5 millimeters, with an accuracy of +/- 0.001mm for die-to-die distance control. It can operate up to 16 spindles, each of which can load up to 11 dies simultaneously. This ensures a high level of performance with low levels of maintenance. The servo motors are capable of delivering a maximum force of 20N, and are finely tuned to provide an accuracy of +/- 0.003mm over a range of speeds up to 250m/min. Additionally, the unit features a touch-screen display that can provide users with real-time performance information. 2008 XP 3 is designed to integrate seamlessly with the user's existing production eP3 reference board. This means that installation and operation of the new machine is made extremely easy and efficient. The tool also features an offline programming mode, allowing users to define motion profiles, program fault inputs and outputs, and trace motion profiles before full production runs. This feature reduces costly downtime and increases accuracy levels. Overall, 2008 xP3 is an automated die attacher designed to provide reliable, high-speed die attach dispensing for a range of applications. Its combination of high level performance, accurate control and easy-to-use software makes it an ideal choice for any die attach application.
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