Used ESEC 2008 xP3 #293761093 for sale

ESEC 2008 xP3 is a die attacher equipment designed to streamline the process of attaching dies onto substrates. The system uses a powerful linear motor drive and a high-speed vision unit to accurately and quickly attach dies onto substrates with precision. The machine uses a fully programmable, 10-axis motion control tool and a state of the art vision camera linked to a servo-controlled die attach head to create an ideal environment for accurately placing each die. ESEC 2008XP3 can be used for many types of die attach applications from the smallest 0402 size to the larger power devices. The linear motor drive on 2008 XP 3 provides a quick and precise positioning of the die attach head, allowing for an accurate attach die placement. The Vision Camera being linked to the die attach head helps to automatically achieve an optimum die attach position on the substrate within the tolerance set for each application. 2008 xP3 is equipped with a full suite of die attach processes, including adhesive process, pre-bonding process, post-bonding process, edge-integrity-bonding process, and non-contact process. All of these processes can be selected and adjusted within the control asset to ensure the highest quality attach with the lowest cycle time. 2008XP3 also offers a wide range of trace levels and trace ratings to ensure the highest levels of accuracy. The trace levels range from 0.2 mm to 3 mm, and the trace ratings range from 10 (no trace) up to 50 (full trace). The trace and rating ensure that each die attach is accurately and securely attached to the substrate. To further ensure accuracy, the die attach features built-in collision protection to prevent any misplaced die attach and to avoid any potential damage caused by overdrive. Overall, ESEC 2008 XP 3 is a robust and reliable die attacher offering quick and precise die attach in high volumes, as well as providing collision protection for added peace of mind. This robust and reliable model ensures that every die attach is accurately and securely attached to the substrate, helping to create a reliable and efficient production process.