Used ESEC 2008 xP3 #293761291 for sale

ESEC 2008 xP3
Manufacturer
ESEC
Model
2008 xP3
ID: 293761291
Die bonder.
ESEC 2008 xP3 is a state of the art, low weld, high-speed die attacher machine specifically designed to meet the needs of the modern packaging industry. The equipment is a full scale production die attacher with a coordinated set of features to speed up the production of die packages for a variety of applications. This die attacher features a stainless steel construction and utilizes advanced static and dynamic die sensing systems to precisely apply standardized welds across all surfaces of the die package. The xP3 die attacher offers a high-accuracy ±.002" tolerance for applications where millimetric accuracy is necessary. It utilizes an advanced microprocessor based control system to provide fast, reliable, and accurate die placement. The xP3 includes a USB interface that allows the unit to be easily upgraded, allowing for improved speed and accuracy. The machine includes specialized welding, pressing, and scanning controllers to ensure the package is properly assembled and die electrical contact testing is performed on each product. The high weld quality and low operating costs of ESEC 2008XP3 make it an ideal choice for applications where time and accuracy are essential. This tool can also be configured to die package requirements such as sprocket and hub systems, multipin connectors, wire edge and wrap connections, as well as custom die packages and adapters. The die attacher is also compatible with a range of test systems to ensure only the highest quality products are being produced. For added convenience and mobility, the xP3 die attacher asset is mounted on a portable frame. This feature allows for easy movement between production lines and easy maintenance. The entire model can be operated from a standard 115 VAC power supply and has built-in lighting for visibility. The self-diagnostics feature also increases operational efficiency, with user-friendly error notifications that appear if the welding or testing parameters are out of range. Overall, 2008 XP 3 die attacher equipment offers a highly efficient and productive system for automated die package assembly. With its advanced weld and test control capabilities, the xP3 allows for optimal accuracy and repeatable performance without sacrificing production speed. This makes the unit an ideal choice for companies that require precision die packaging.
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