Used ESEC 2008 xP3 #9069535 for sale

ESEC 2008 xP3
Manufacturer
ESEC
Model
2008 xP3
ID: 9069535
Vintage: 2002
Die bonder 2002 vintage.
ESEC 2008 xP3 is a pneumatic three-dimensional die attacher which can efficiently and accurately attach dies onto printed circuit boards. It is designed to handle a wide variety of die sizes and shapes, and to minimize the physical demands placed on assemblers. The xP3 utilizes a robust, pneumatic mechanism to precisely feed die onto the circuit boards, for a consistently high quality result. The xP3 has a feeder tray that holds up to 130 components. The feeder has an adjustable skid plate, allowing operators to select the pitch of the die to match the pitch of the circuit board being used. It also features adjustable tension plates which provide an adjustable feed rate to ensure that the correct pitching is achieved. The machine also includes an ejector tray which allows operators to quickly remove any components that do not fit properly. The xP3 also features a three-dimensional work area which enables consistent placement of components by minimising the surface-to-surface contact with the printed circuit board. The machine is designed for use with standard adhesive tapes, allowing operators to quickly and conveniently attach dies to circuit boards. The xP3 includes several safety features to ensure the safety of operators. Its pneumatic mechanism operates around low-pressure levels, reducing the risk of component damage. It also features a foot switch, which enables the operator to stop the machine quickly if required. The xP3 is designed to be highly user-friendly and simple to operate. It has an intuitive user interface, allowing operators to easily enter commands, adjust settings, and monitor the progress of their work. The machine also includes a sensor system which provides feedback to the system so that it can keep track of its position and prevent any potential misplacement of components. The xP3 is an effective and efficient die attacher which will help streamline the processes involved in attaching die to circuit boards. It provides precise and consistent results, and a range of safety features to protect operators from potential hazards.
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