Used ESEC 2008 xP3 #9083248 for sale

ESEC 2008 xP3 is a fully automated die attacher equipment for smart and efficient fixing of dies to substrates. The system supports various substrates such as packages, printed circuit boards, lead frames and others. The die attach process is a very delicate process as it involves delicate mechanical and thermal operations, hence ESEC has developed the xP3 with advanced mechatronic qualifications to ensure reliable and precise die attachment. The xP3 is designed with axis motors, precision tools and vision systems to provide accurate and consistent die attach with repeatable processes. The unit consists of a vision machine mounted on the machine head to detect the position and orientation of each die for accurate die placement. It is equipped with force feedback sensors and a temperature monitoring tool to ensure accurate die placement and process parameters. ESEC xP3 is capable of handling wafer sizes up to 300 mm in diameter and die sizes down to 0.1 mm. The asset is compatible with a variety of thermal processes such as elastometric epoxy (ECE) dispensing, flip chip, micron particle pick and place, and ball-grid array (BGA) attach processes. It also provides a wide range of process parameter settings to accommodate various die attach processes. In addition to the die attach process, the xP3 also provides a model for testing and inspection, ensuring all parts are in compliance with quality standards. The equipment offers a range of post-attach tests such as mechanical strength testing and electrical testing. ESEC xP3 die attacher system has been designed to provide manufacturers with unprecedented accuracy, speed and flexibility. The unit has been proven to reduce costs and manufacturing time, while increasing throughput and reducing labor costs.