Used ESEC 2008 xP3 #9098876 for sale

ESEC 2008 xP3 is a die attacher that provides efficient and accurate alignment of the dies to the substrate. This is a versatile tool designed to provide optimal accuracy and reliability in a variety of surface mount, ball grid array (BGA), chip-on-board (COB), tape-automated bond (TAB), and other fine-pitch applications. ESEC 2008XP3 utilizes a pouch-type aligner head with high optical resolution scanning and advanced image recognition technologies, making it capable of handling ultra-fine pitch components. It is designed to reduce cycle time and cost while optimizing process control for precision component placement. 2008 XP 3 is capable of die placement accuracies of 3 microns (.0001") or less when placed over a substrate, and provides alignment speeds of up to 6 picks per second. It also has the ability to store up to 65 die pick and placement positions as part of its programmable form library. The xP3 is composed of an electronic controller, pneumatic grippers and servomotors, and a user-friendly touch screen operator interface. It can be setup for right, left, and dual pick from either cassette or wafer form formats. Additionally, it has two sets of LED operated non-contact double vision cameras that control four optical zoom lenses. The vision cameras can also automatically detect the die feature sizes, angles, and part positions. In order to reduce cycle time and improve die placement accuracy, the xP3 offers a variety of advanced features, including process control, cycle time reduction, data management, and visual inspection capabilities. Additionally, dynamic machine parameters and servo parameters are optimized, ensuring optimum machine performance. 2008 xP3 is designed to provide precise, reliable output for various types of surface mount and other fine-pitch components. Its advanced features enable quick, accurate die placement and improved machine performance, while its user-friendly interface allows for smooth, efficient operation.