Used ESEC 2008 xP3 #9098974 for sale

ESEC 2008 xP3 is a die attacher designed and manufactured by ESEC Corporation. The xP3 die attacher is an advanced, cost-effective addition to any die bonding process. Its innovative design allows for high bevel angle and bond-line accuracy, resulting in the highest possible yield rate and improved wire bonding quality. The xP3 die attacher uses an advanced pick and place mechanism for consistent placement accuracy, as well as a built-in vision equipment to ensure alignment accuracy. In addition, the xP3 die attacher can accommodate high-speed motion for a wide range of die sizes. The pick and place cycle speed of 0.2 seconds per die makes the xP3 die attacher one of the fastest die Bonders on the market. For secure and accurate Bonding, the xP3 die attacher is designed with a 3-point die clamping system and pre-defined coordinates for each die placement. This unit eliminates the need for manual die placement and greatly improves repeatability in production. In addition, the xP3 die attacher is equipped with an ultrasonic wire-bonder with a vacuum pre-wire placer, allowing for high-accuracy fine-pitch wires. The integrated vision machine of the xP3 die attacher ensures accurate placement in different environments. The tool can recognize various chip types and sizes and align them according to the exact pre-defined coordinates of each die. This ensures efficient and accurate production for a wide range of products. The xP3 die attacher also features an intuitive user interface and advanced diagnostics for fast and reliable operation. The user interface provides a detailed description of asset parameters and even allows for remote and local programming. The advanced diagnostics capabilities enable users to quickly identify and troubleshoot problems. In conclusion, ESEC 2008XP3 die attacher is a reliable, cost-effective die bonding solution that offers repeatable, reliable results for a wide range of die sizes. Its pick and place cycle speed of 0.2 seconds per die, advanced 3-point die clamping model, ultrasonic wire-bonder, vision equipment, and intuitive user interface make this die attacher the go-to solution for its range of applications.