Used ESEC 2008 xP3 #9100696 for sale

ESEC 2008 xP3 is a die attacher machine designed for high-precision placement of small dies on substrates. It is small in size but big in performance, and is ideal for producing high-quality die-attach products. The machine is equipped with dual vision systems, with one set on the die and the other on the substrate. These vision systems allow the machine to accurately place the die and orientate it in the right direction. The machine also provides integrated die clamping, allowing the die to be secured firmly in place during bonding. ESEC 2008XP3 is equipped with auto spot-bonding technology, which ensures accurate die placement and attach quality at all times. The machine also features a programmable controller, allowing users to adjust the bond parameters such as temperature, pressure, time, and dwell. Its intuitive user interface and touch panel make it easy to configure the machine for different operations. For further precision, 2008 XP 3 contains an automated alignment equipment which allows for accurately positioning the dies on the substrate. This system also allows for the placement of small components while avoiding any damage to the surrounding material. The numerical control ensures repeatable results and allows for automatic tool-loading and calibration. 2008 xP3 has additional features such as a radiation protection unit and a protective enclosure that ensures safety during operation. Another feature is the use of specially designed pick and place nozzles, which can motion up to 6 different components at the same time, significantly increasing productivity. Overall, 2008XP3 is an advanced die attacher machine designed for high-accuracy placement of smaller dies on substrates. Its auto spot-bonding technology ensures precise placement and attach quality while its built-in features such as the alignment machine, protective enclosure, and pick and place nozzles make it an ideal choice for high-productive die-attach operations.