Used ESEC 2008 xP3 #9163558 for sale

ESEC 2008 xP3 is a die attacher that is used to apply adhesive bonding dots on the surface of wafers. The die attacher applies a predetermined amount of epoxy with a sophisticated nozzle, using air pressure to accurately and precisely deposit adhesive. This ensures a uniform application of adhesive, which ensures a dependable and reliable application each and every time. ESEC 2008XP3 die attacher has an active board that is integrated with a digital triple servo motor control equipment. This system is used to control its movements and movement parameters, including speed and acceleration. The triple servo motor control unit accurately positions the head of the die attacher, resulting in high-precision movement. It also allows for the control of multiple parameters, including pressure and cycle time. This machine ensures that the die attacher is able to accurately place adhesive dots on the wafers. 2008 XP 3 also features a die position tool that is specifically designed to reduce and/or eliminate positioning error. This asset ensures that the adhesive dots are precisely and accurately placed.The model also utilizes an "overlap edge" feature that accurately detects the position of the wafer and automatically adjusts the vacuum distributor. This ensures that each adhesive dot is accurately and precisely placed, ensuring a dependable bond each and every time. Additionally, the die position equipment has built-in safety features to prevent damage to the wafers and the tool. ESEC 2008 XP 3 also has a wide range of options and features that make it an ideal choice for die attaching applications. These include a die collector system, a wafer overlay unit, the ability to program a variety of different parameters, and a built-in monitor that displays current operating conditions. 2008XP3 also has a user-friendly interface, making it easy to operate. Overall, 2008 xP3 is a top-quality die attacher that offers reliability, precision, and ease of use. Its sophisticated triple servo motor control machine, die position tool, and range of features make it an ideal choice for die attaching applications. It is also a cost-effective solution that is designed to provide dependable performance and cost savings.