Used ESEC 2008 xP3 #9263231 for sale

ESEC 2008 xP3
Manufacturer
ESEC
Model
2008 xP3
ID: 9263231
Die bonder.
ESEC 2008 xP3 is a die attacher for the semiconductor industry. It is designed with both a standard and a premium model to meet the needs of any manufacturer. The xP3 features a long boardloader conveyor to help with flexible die assembly and placement, a vacuum pick-up equipment for precise die placement, a high-speed die elevator, a heated tweezer system to help minimize bonding damage, and a universal vision unit for very precise die placement. The xP3 also has a new XMark software machine to enable easier programming and operation by manufacturers. The long boardloader conveyor of the xP3 has three sections for maximum flexibility, and can handle board sizes ranging from 1" to 19". The conveyor can increase the speed of die assembly by up to 30%, providing reliable placement every time. The vacuum pick-up tool manages delicate dies, while an integrated part eraser ensures the quality of die pick and bond. The heated tweezer asset processes complex die patterns quickly and accurately, and features a tweezer temperature control to help reduce the possibility of damage to dies, while an air-cleaning model helps keep the tweezer attachments free of any debris. Additionally, the xP3 is equipped with a multi-zone vision equipment for greater accuracy and resolution of die placement. The xP3 also has the XMark software system, which allows for fast and easy programming of jobs. The software also allows users to monitor and control the entire process from one convenient location, as well as view a real-time image of the xP3's play-field. The software also offers extensive statistical traceability and detailed job reporting for easy evaluation of data. Finally, the xP3 has numerous safety features to protect users and the machine, including key-lock door switches and built-in fire extinguishers. The xP3 also has a separate control box and air filter for additional safety measures. Overall, ESEC 2008XP3 is designed to provide a fully-integrated die attachment solution for the semiconductor industry. It features a long boardloader conveyor, vacuum pick-up unit, heated tweezer machine, universal vision tool, and XMark software for easy programming. Additionally, the xP3 is equipped with numerous safety features for added protection of users and the machine.
There are no reviews yet