Used ESEC 2008 xP3 #9268606 for sale

ESEC 2008 xP3 is a high-performance die attacher made by ESEC Corporation. The machine is designed to quickly and accurately attach small electronic components, such as resistors and capacitors, to printed circuit boards (PCBs). The attacher operates on a three-axis equipment, where the XY-axis moves the component and the Z-axis moves the needle. ESEC 2008XP3 has a maximum movement speed of 11,000 ?m/sec in XY and 50 ?m/sec in Z. 2008 XP 3 uses a Vision Positioning System (VPS) to locate and align the component accurately. The machine also has a vacuum pickup tool for secure contact of the components. This tool is adjustable so it can handle components of various sizes. An image is streamed to the controller for alignment on the board and for inspection. 2008XP3 is compatible with various component types such as chipsets, SOICs, PLCCs, CSPs, QFNs, and others. It also has a selection of feeders, which include tape, tray, tube, and stick. The machine has a 3D color camera and comes with a software package that includes autoscaling, pick-up optimization, and pattern recognition. This die attacher has a simple and efficient user interface. The unit runs on a Windows-based OS for easy operation. To ensure accuracy and repeatability, ESEC 2008 XP 3 maintains a self-diagnostic machine that monitors machine components, including the vacuum and vision systems. It can be used in a variety of industries, such as automotive, consumer electronics, and medical sectors. 2008 xP3 is an advanced die attacher designed for industries requiring high accuracy and repeatability. The machine is fast, reliable, and easy to use, providing users with efficient component attachment processes. Its powerful 3D vision alignment tool, vacuum pickup tool, and selection of feeders make it an excellent choice for quality PCB attachment.