Used ESEC 2008 xP3 #9329201 for sale

ESEC 2008 xP3 is a robust die attacher for the semiconductor industry. It offers the ability to attach dice to a thin film substrate in a reliable, high-yield manner. The xP3 utilizes vacuum-assisted die placement in order to achieve precise placement of dice on the film. This ensures that the dice are firmly attached and provides a very high throughput rate. The xP3 is capable of accommodating large numbers of dice, up to tens of millions. This allows for higher volumes of dice to be processed in a shorter period of time, thereby decreasing the product cycle time and costs. The xP3 features a die ejection equipment with several different options, allowing the user to select the number of dice to be attached and at what forces. The xP3 also incorporates a number of other features that make it one of the most advanced and reliable die attachers on the market today. It has one of the best sequential placing speeds in the industry, allowing for a higher throughput rate. The system also has an accurate pick and place vision unit, which ensures that the dice are placed accurately. The xP3 also includes an automatic calibration machine, which ensures repeatable, accurate results every time. The xP3 is equipped with an integrated controller, which allows the users to access and control the xP3 tool from any computer on the network. This makes it easy to operate and maintain the xP3. This asset also allows for advanced statistical analysis to be performed, allowing for the user to further refine the quality of their dies. The xP3 model is designed to be easy to install and use, allowing for quick setup and minimal maintenance. It is lightweight and compact, making it easy to move to different sites. The xP3 is a reliable, high-yield die attacher that is perfect for semiconductor manufacturers who need to handle large volume applications. It is a perfect choice for anyone needing a reliable and efficient die attacher equipment.